麻烦帮小弟翻译下~

发布网友发布时间：2022-05-05 11:46

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热心网友时间：2022-06-27 11:34

Wafer bonding technology is the means through chemical and physical role will be silicon and silicon, silicon and glass or other material that closely integrated approach. Bonding with the silicon surface often silicon processing and the combination of silicon processing, used in the processing of MEMS. The common bond of silicon technologies, including the melting of the silicon, silicon / glass-key legal, silicon / silicon direct bonding legitimate and glass solder sintering law.
This paper is important silicon / glass Yang made a key legal research, the focus is on bonding in the process of routing, it is necessary to find out the shortest path which will be used in the simulation of the actual bond, making the process more simulation Convenient.

麻烦 帮小弟翻译下~

麻烦帮小弟翻译下~