发布网友 发布时间:2023-05-27 06:20
共1个回答
热心网友 时间:2024-12-02 04:11
Scanning acoustic microscope
扫描声波显微镜
Scanning acoustic microscope ( sam ) can be used to detect package delaminations and quickly identify the failure cause at the early stage of failure *** ysis
扫描声学显微镜可以用来检测封装分层,能在失效分析的早期阶段快速地鉴别失效原因。
A scanning acoustic microscope ( sam ) can be used to detect package delaminations and quickly identify the failure cause at the early stage of failure *** ysis
扫描声学显微镜可以用来检测封装分层,能在失效分析的早期阶段快速地鉴别失效原因。
According to the m1l - std - 883c standard of thermal cycle loading , the delamination propagation rates at the interface beeen chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for o types of fpp chip packages with different states of solder joint
采用mil - std - 883c标准,通过温度循环实验,使用高频超声显微镜( c - sam )无损检测技术,测量了在不同焊点状态下, b型和d型两种实际倒装焊封装芯片与底充胶界面分层裂缝传播速率。